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OLEDInline systems and offline equipment for both production control and development of OLED layers and stacks.
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OLED offline measurements
OLED inline measurements
NXT offers unique equipment to measure the layer thicknesses as well as refractive and absorption index of any kind of layer or stack, taking surface roughness into account. The system is designed and optimized for offline testing and is upgradable to future demands. Both organic and inorganic layers can be measured.
● Layer thickness 3nm-500nm
● Spectral material properties n(λ)/k(λ)
● Surface roughness
● Refractive index profiling for ITO (N(z))
● Reflectance and transmittance spectra taken within milliseconds
● Organic materials
● Dielectric layers
● Metallic, semireflective and conductive layers
● Offline testing of standard samples and special development cases
● Single-point measurements and serial measurements for a set of samples
● Cost-effective, modular setup
● Automatic internal calibration
● Contactless and non-destructive
● SCAN: x-y-mappings and one-directional scans
Unique AudioDev oscillatory model: Fast and easy design of own parameter sets for n&k
NXT offers unique equipment to measure the layer thicknesses of any kind of layers or stacks. Surface roughness is taken into account as well.
The system’s optical RT-heads are designed and optimized for high-accurate and stable inline testing to guarantee absolute measurement results under production conditions.
● Special design of both R- and T-head for highest value stability with respect to height and tilt tolerances in production
● Inspection through glass windows: No affection of production during maintenance and service
● Automatic internal calibration
● Contactless and non-destructive
● Layer thickness 3nm-500nm
● Spectral material properties n(λ)/k(λ) incl. data base of common materials
● Surface roughness can be set
● Reflectance and transmittance spectra taken with highest accuracy
● Auto-triggering or I/O with the line
● Monitoring of thicknesses in real-time, without disturbing the production process
● Fast measurement speed
HELIOS-R8
HELIOS-TN
HELIOS-RC
Reflectance, Layer Thickness of Poly-Si Coating of TOPCon Solar Wafers
In the production of modern, highly efficient TOPCon solar cells, Poly-Si layers are deposited on the etched rear side of the solar wafers over an extremely thin tunnel oxide layer. Both the layer thickness and the processdependent optical constants of the Poly-Si layer determine the quality of the solar cells, especially the selective passivating contact on the rear side. The Helios-r8 inline and offline measuring systems are perfect instruments to analyze and optimize the coating process of your solar wafers with Poly-Si. It enables you to measure the layer thicknesses and the spectral optical constants n&k of the layers on the etched rear sides of the wafers. Because of its high measurement speed, the Helios-r8 is perfectly suited for inline measurements and homogeneity measurements of the Poly-Si layers, where several points on the wafer surface are measured.
The Helios-r8 systems are specifically designed for controlling poly-Si coatings on the rear side of TOPCon solar wafers. They provide precise measurements of layer thickness and optical constants (n&k), which are essential for ensuring high-quality selective backside passivation contacts. Available in inline or offline (manual or scan) versions, they provide fast and reliable results for production and laboratory use.
● Single-point measurement √
● Reflectance at user-definable wavelength √
● Coating layer thickness √
● User-definable quality limits √
● Good / Bad indication √
● Integrated fixed reference √
● Average Reflectance within a selectable wavelength interval √
● Manual single axis table √
● Automation full wafer mapping √
● Offline and inline configurations
● Non-contact, non-destructive measurement
● Fast, static point-by-point or real-time inline measurement
● Poly-Si layer thickness (50–450 nm)
● Refractive index n&k (3.0–4.5)
● Reflectance spectra
● TOPCon solar cells (n-type, p-type, bifacial)
● Etched rear side (acidic/alkaline, bare etched)
● Integrated reference standards
● Insensitive to wafer rotation, tilt, distance, or surface roughness
● Very fast measurement (≤200ms per point)
● Easy operation with user-definable quality limits and good/bad indication
Thickness and Refractive Index of Silicon Nitride
For wafer based solar cells the anti-reflective coating, surface passivation and diffusion barrier play an important role to achieve high solar cell efficiency and long term stability. Because of its excellent characteristics Silicon Nitride coating (a-SiNx:H) is widely used for this purpose. Process parameters like gas pressure and temperature of the cell during deposition have a strong influence on the layer thickness, colour and the optical constants n&k of Silicon Nitride. Traditionally it takes time and skills to obtain a precise coating distribution map to enable process optimization.
Using industry-proven spectrometer technology and proprietary measurement algorithms, Helios-tn combines speed, precise measurement and easy operation – all of which are needed to optimize processes at lowest cost and shortest line downtime.
The Helios-tn systems are ideally suited for monitoring and controlling coating processes on silicon-based solar wafers. They offer highly precise.
● Offline / contactless and non-destructive
● High-speed mapping function
● mc- & pc-wafers (polished, rough or textured)
● 125x125mm / 156x156mm
● Isotropic and anisotropic chemically etched
● RIE (Reactive Ion Etched)
● PE-CVD
● Magnetron Sputtering
● Pre-configured mapping templates
● No special skills required for operation
● Select recipe. Start measurement. GO!
Total Reflectance, Color and Layer Thickness of Coated and Uncoated Silicon Solar Wafers
The surface texturing of crystalline solar cells plays an important role to achieve high solar cell efficiencies. The texturing reduces reflectivity losses significantly and has a strong impact on the passivation of the cell. In addition to the texturing process step itself, the quality of the silicon material and the wafer sawing process have impact on the texture. Therefore, it is essential to gain detailed knowledge of the texturing. This knowledge and process control can be achieved by precise measurement of the total reflectance of the textured cells. Our Helios-rc is the perfect tool to measure, analyze and optimize the widely used chemical texturing processes. It measures the total reflectance of bare and coated solar wafers, as well as the color and layer thickness of coated solar wafers.
Measurement of the total spectral reflectance is a good and accepted method for maintaining a stable texturing process. The texturing affects the average level of the Reflectance and also the amount of spread/variation of the Reflectance over the
wafer. Both, the average Reflectance level and the variation of the Reflectance over the wafer, are important and need to be controlled.
Helios-rc systems are designed for precise monitoring and control of texturing and etching processes on solar wafers. These systems measure the total reflectance of the textured front side and the spatial angle reflectance of the back side of the wafer to ensure optimal surface treatment. Additionally, they can measure the thickness of thin layers on either the front or back of the wafer. Available in inline or offline (manual or scan) versions, they provide fast and reliable results for production and laboratory use.
● Single-point measurement √
● Integral total spectral reflectance measurement √
● Wavelength and reflectance value at lowest reflectance √
● Reflectance at user-definable wavelength √
● Coating layer thickness √
● User-definable quality limits √
● Good / Bad indication √
● Integrated fixed reference √
● Average Reflectance within a selectable wavelength interval √
● Color evaluation √
● Manual single axis table √
● Manual full wafer mapping √
● Offline
● Contactless and non-destructive
● Static point by point measurement
● Total Reflectance: r (integral)
● Color: c (Lab, xyY, …)
● Layer Thickness: t (for coated wafer)
● mc-wafers (polished, rough or textured)
● pc-wafers (polished, rough or textured)
● 125x125mm / 156x156mm / round / others
● Isotropic chemically etched
● Anisotropic chemically etched
● RIE (Reactive Ion Etched)
● Integrated reference standard
● Manual single-axis table for full wafer mapping
● Easy line scan
TCM Inline
TCM offline
● Measurement of the thickness of insulation layers
● Measurement of wet and dry film
● Measurement without referencing
● Individually integrable measuring heads
● Profile scan of the layer (X-axis) with motorized moving measuring head
● Measurement of 2 adjacent tracks
● Swivel range X-axis: 25 mm
● Manual fine adjustment with adjusters for:
- Z-axis - fine adjustment of working distance
- Tilt fine adjustment relative to the Y-axis
≤ 1 kg
● Dimensions [mm]:
H = 830,W =660,D = 625
● Weight: 58 kg
● Electrical data:
- Voltage: 100 - 240 VAC
- Frequency: 50 - 60 Hz
- Max. power consumption: 400 VA
Measuring system complies with the safety requirements of the Machinery Directive 2006/42/EC.
A UL certification is also available.If needed, please contact us.
● Measurement of dry film
● Integrated PC (also available without PC)
For use in moving sample frame:
● Minimum: 20 × 20 mm
● Maximum (with sample frame): 245 × 245 mm
● Maximum (without sample frame): 600 × 600 mm
● Dimensions: 600 × 600 mm
● Sample frame: 245 × 245 mm
● Dimensions [mm]:
H = 442,B =604,T = 660
● Weight: 45 kg
● Electrical data:
- Voltage: 100 - 240 VAC
- Frequency: 50 - 60 Hz
- Max. power consumption: 460 VA
Measuring system complies with the safety requirements of the Low Voltage Directive 2014/35/EU.
A UL certification is also available.If needed, please contact us.
XELAS
METIS
ARC
● Layer thickness 2nm ∼ 3000nm
● Spectral material properties n(λ) and k(λ)
● Surface roughness
● Special design of both R- and T-head for highest value stability with respect to distance and tilt tolerances of the samples in production
● Mounting at vacuum coaters: Either measurement through glass windows, or
measuring heads built inside the vacuum chamber
● Contactless and non-destructive
● Auto-triggering or I/O with the line
● Monitoring of layer thicknesses in real-time
● Fast measurement speed
● Organic materials
● Dielectric layers
● Metallic and conductive layers
● High layer homogeneity over the entire
sample surface
● Material and process design
● Detailed coating analysis
● Keep production conditions stable and increase production/process yield
● Control the product quality by detailed knowledge of local variations and thickness drift, as well as changes in material properties
● Design new materials, processes and layer stacks by the advanced, unique function optical modelling
Using Integrating Sphere, for coatings on foils/WEB and on large size glasses
Measuring samples can be wavy and in R2R applications,
fast-moving foils can vibrate
● Spectral range:Spectra: < 0,4% (400nm – 1000nm)
● Long-term stability by internal correction channel
● Precise color measurement
● LITE (Fixed Sample table)
● LAB (Manual operated Sample table)
● SCAN (Automatic Mapping table)
● INLINE (fixed or motorized scanning)
● 5nm – 20µm
● Single layers and layer stacks
● Measurement of optical constants n&k
Spectral range:
● 380 – 1070nm
● 360 – 1050nm (option)
● 850 -1700nm (option)
2 spectral ranges combined:
● 360 -1700nm (option)
● ±5 mm distance variation
● ±2° tilt variation
● < 0.1 sec/point (spectra acquisition)
Process control and quality, with non-destructive sampling
The only truly effective way to meet quality goals and achieve cost effective production is to apply comprehensive non-destructive testing.
NXT offers a unique contactless measurement instrument that can quickly and accurately measures spectral reflectance and color appearance of anti-reflective (AR) coatings, or coating layer thickness of hard coatings and varnishes on transparent and translucent curved surfaces.
● It successfully suppresses rear-side surface reflection, which eliminates the need to roughen or blacken the sample. This means that tested products can also be sold.
● Fast measurement of spectral reflectance, and evaluation of layer thickness and colorimetric data, enables larger QA samplings to be made – 100% if so desired.
● Comprehensive measurement documentation supports traceability and repeatability, making continuous process improvement possible.
